Denso, USJC to produce power semiconductors


In recent years, the automotive industry has been largely affected by the shortages of vital components, such as semiconductors. To answer the growing demand for automobile microchips, Denso Corporation and United Semiconductor Japan Co., Ltd. (USJC), have agreed to enter a collaborative partnership to produce power semiconductors.


  • What contribution will Denso have to further this initiative?

    According to Denso, it will lend its system-oriented IGBT device and process technologies as its contribution to the collaborative effort.
  • What contribution will USJC offer to achieve the goals of this partnership?

    To help Denso, USJC will provide its 300mm wafer manufacturing capabilities to bring the 300mm IGBT process into mass production.
  • “Denso is very glad to be a member of the first companies in Japan to start mass production of IGBTs on 300mm wafers. Semiconductors are becoming increasingly important in the automotive industry as mobility technologies evolve, including automated driving and electrification. Through this collaboration, we contribute to the stable supply of power semiconductors and electrification of automobiles,” said Denso President Koji Arima.

    According to Denso, USJC will install an insulated gate bipolar transistor (IGBT) line at its wafer fab. Once completed, the said installation will be the first in Japan to produce IGBTs on 300mm wafers.

    USJC will provide its 300mm wafer manufacturing capabilities to bring the 300mm IGBT process into mass production while the Kariya-based automotive components manufacturer lends its system-oriented IGBT device and process technologies.

    “As a key foundry player in Japan, USJC is committed to supporting the government’s strategy to boost domestic semiconductor production and the transition to more environmentally friendly electric vehicles. We are confident that our foundry services certified by automotive customers combined with Denso’s expertise will produce high-quality products to power the automotive trends of tomorrow,” said USJC President Michiari Kawano.

    “We are pleased to have this win-win collaboration with a leading company such as Denso. This is an important project for UMC and will expand our relevance and influence in the automotive segment. With our robust portfolio of advanced specialty technologies and IATF 16949 certified fabs in diversified locations, UMC is well placed to serve demand across auto applications, including advanced driver assistance systems, infotainment, connectivity, and powertrain. We look forward to capitalizing on more cooperation opportunities going forward with top players in the automotive space,” added UMC Co-President Jason Wang.

    The collaboration between companies is backed by the renovation and decarbonization program for indispensable semiconductors of Japan’s Ministry of Economy, Trade, and Industry.

    Photo from Denso

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